Product Introduction
When your copper plating line suffers from uneven through-hole deposition, rapid anode decay under reverse pulse cycles, or mismatched electrode layout with automation tanks, the Titanium Anode For Copper Plating offers a proven technical upgrade. With verified AR>8:1 cavity uniformity and custom-fit options for fly-bar tanks, it's ideal for clients seeking stable performance, long anode lifetime, and CAD-based electrode solutions.
Product Parameter
Tested under acidic copper sulfate bath, 200 A/m², 35°C, 8 hours/day.
Product Features & Application
■ Stable Deposition in Deep Cavities
Verified uniformity ±2.5% in 8:1 through-holes per IPC-6012E; reduces plating deviation in multilayer HDI boards.
■ Pulse-Compatible Design
Tested for 50ms/50ms reverse pulse cycles with <1.5% current fluctuation; ideal for advanced PCB and IC substrates.
■ Fly-Bar Matched Mesh & Terminal Design
Electrode groups and mesh geometry customized according to your CAD tank layout for seamless integration.
■ Use Case Highlights
- HDI board blind via copper filling in Tier 1 PCB fabs
- Automotive hydraulic valve body copper plating lines
- Aerospace connector plating in NADCAP-certified factories
- Lead frame and BGA substrate copper layer formation
Titanium Anode For Copper Plating is widely applied in these high-precision environments for stable current flow and improved process yield.
Product Details
■ Substrate: Cold-rolled Grade 1 titanium with etched surface for strong coating adhesion
■ Coating: Ir-Ru MMO or Pt, applied via gradient thermal decomposition
■ Sintering: Multi-zone ramp-up to 700°C in inert gas for optimal bonding strength
■ Available Versions:
– Model -D: 12 μm for AR>8:1 holes
– Model -M: Micro-mesh for fine-pitch PCB tanks
■ Quality Control:
– SEM inspection with defect density <3/cm²
– Batch-level EDS coating verification included
After-Sales Service
why choose our products
■ 12-month warranty covering both coating integrity and mesh structure
■ Technical support response within 24 hours (business days), including video troubleshooting
■ Each order includes a 5×5 cm test sample for plating compatibility validation
■ Lifetime simulation provided based on your current density, bath composition, and duty cycle
■ Optional recoating with original sintering profile and mesh structure preserved
FAQ
Q1: How is anode lifetime estimated for reverse pulse copper plating lines (50ms/50ms)?
A: Under standard 200 A/m² load, the baseline lifespan is ~8000 hours. For pulse mode, apply a 0.85 correction factor. Reference data available from 18-month deployment in Tier 1 PCB lines.
Q2: Can the anode be designed to match our fly-bar and rack layout?
A: Absolutely. We support fly-bar drawing integration, matching mesh cutouts, terminal placement, and connector design.
Q3: Is this anode suitable for organic additive-heavy baths?
A: Not recommended for >20% organic additives. Consider switching to our TA-OR series for such environments.
Q4: What documentation is included with each shipment?
A: Full SEM/EDS reports, ASTM F3091 compliance certificate, and IPC-6012E compatibility declaration.
Q5: Can I preview the anode before placing a full order?
A: Yes, we provide free small-format samples (5×5 cm) for predictive testing upon request.
Company profile
Baoji Zhongxinbao Metal Materials Co., Ltd. specializes in high-performance titanium anodes for copper plating in HDI PCB, automotive electronics, and precision metal finishing. From deep-via uniformity to fly-bar matched electrode groups, we offer end-to-end design, verification, and customization support trusted by global Tier 1 manufacturers. Our Titanium Anode For Copper Plating is engineered to deliver consistent performance in demanding copper deposition environments.
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